F4BTMS1000 PCB High-Performance 2-Layer Rigid PCB for Aerospace Applications
1.PCB Construction Details
| Specification | Details |
|---|---|
| Base Material | F4BTMS1000 |
| Layer Count | 2 layers |
| Board Dimensions | 85mm x 40mm (1 piece, +/- 0.15mm) |
| Minimum Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | None |
| Finished Board Thickness | 0.6mm |
| Finished Copper Weight | 1oz (1.4 mils) on outer layers |
| Via Plating Thickness | 20 µm |
| Surface Finish | OSP |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Testing | 100% electrical test prior to shipment |
2. PCB STACKUP
| Layer | Details |
|---|---|
| Copper Layer 1 | 35 µm |
| F4BTMS1000 Core | 0.508 mm (20 mil) |
| Copper Layer 2 | 35 µm |
3. PCB STATISTICS
Components: 21
Total Pads: 60
Through-Hole Pads: 33
Top SMT Pads: 27
Bottom SMT Pads: 0
Vias: 41
Nets: 2
4.ARTWORK AND QUALITY
Type of Artwork Supplied: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
5. F4BTMS Introduction
The F4BTMS series is an advanced version of the F4BTM series, featuring significant improvements in material formulation and manufacturing processes. This material integrates a high percentage of ceramics and ultra-thin glass fiber cloth, enhancing performance and offering a wider range of dielectric constants. It is particularly suitable for aerospace applications and can replace similar foreign products.
The incorporation of ultra-thin glass fiber and uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin minimizes the negative effects of glass fiber on electromagnetic wave propagation, reducing dielectric loss and enhancing dimensional stability. This innovation increases the usable frequency range, improves electrical strength, and enhances thermal conductivity while exhibiting low thermal expansion and stable dielectric characteristics.
The F4BTMS series features RTF low roughness copper foil, which reduces conductor loss and provides excellent peel strength. It is compatible with both copper and aluminum bases.
6. Features of F4BTMS1000
Dielectric Constant (Dk): 10.2 at 10GHz
Dissipation Factor: 0.0020 at 10GHz, 0.0023 at 20GHz
CTE (Coefficient of Thermal Expansion):
x-axis: 16 ppm/°C
y-axis: 18 ppm/°C
z-axis: 32 ppm/°C (-55°C to 288°C)
Low Thermal Coefficient of Dk: -320 ppm/°C (-55°C to 150°C)
High Thermal Conductivity: 0.81 W/mk
Low Moisture Absorption: 0.03%
7. Typical Applications
Aerospace equipment and cabin systems
Microwave and RF applications
Military radar and feed networks
Phase-sensitive and phased array antennas
Satellite communications and more